HIGH TECH

The simulation solutions from SIMUSERV have been utilized by several electronic and high-tech firms for development and design of modern electronic components. These systems have ability to apply multiple load types on electronic devices for predicting their performance. The designers can also manage the issues which occur in electronic assemblies and control them effectively in design phase itself. Paper feeding machines, semiconductors, circuit boards and mobile phones are some of the devices for which our electronic simulation system works efficiently. There is also facility for coupled-field testing of different load regime like electrical, mechanical and thermal.

The simulation suite has features like drop test, structural analysis, electrostatic analysis and electromagnetic compliance to name a few which ensures efficient design for electronic components.

 

SOLUTION CAPABILITIES

The mobile phone designers have to face issues related to acoustic design as the space for acoustic cavities is reduced. Also, the speaker size in the phone has to be small with same power as that of a large speaker. Some other speaker related phenomenon includes diffraction, emission, radiation and sound transmission.

These and various other issues drive the need of efficient acoustics design through proper simulation. So, the acoustics engineers and mobile phone manufacturers can take support of simulation suite from SIMUSERV which comprises of FEA integrated solutions.

Different types of acoustic systems where simulation can be applied in design and development phase include mobile device speakers, ear phones, sound systems and hearing aids.

The system comprises of state-of-the-art solvers that can be utilized for acoustics. Also, to generate acoustic cavities, there are Boolean tools in the software along with tools to create complicated electronic assemblies.

It becomes imperative for circuit board developers and designers to upgrade the mechanical and thermal response for efficient performance. There are various challenges faced in designing of these boards like fatigue performance during flexes; layered structure and calculation of flat board shape.

The designers can utilize Abaqus solutions from SIMUSERV which can help in suitable component placement in flexible and rigid circuit boards. The system can help in predicting the mechanical, thermal and electrical behavior of the circuit boards. Also, the system has calibration tools are available for simulation associated with lead-free and leaded solder along with wide range of materials for modeling.

Different situations like installation, transfer and shipping can lead to shock loading in computer hardware. So, it is essential for hardware developers to prepare the peripherals which can withstand these shocks.

The simulation system from SIMUSERV ensures that computer and peripherals designs can be prepared through simulation to comply with thermal performance; efficient sliders, hinges and related mechanisms along with protection against shipping shock. Stabilization and contact processes present in the system helps in simulation of media transport in hardware like faxes, printers and other devices. Also, designers can simplify the models through mechanism style connections. The designers can test the behavior of solder joints in case of different types of failures.

The makers of hand-held devices and mobile phones must produce the simulation designs robustly and quickly for better profits of the organization. The analysts, designers and developers should work in association so that the new models of the hand-held devices and mobile phones can reach the market quickly after beginning of the design phase.

The producers of these mobile devices can rely on simulation suite from SIMUSERV which helps in examining the thorough details related to the product throughout its design cycle. An advanced version of mobile design has ability to withstand in various types of harsh conditions. Also, this type of version has decreased weight and size of the device and enhancement in screen size.

MEMS or micro-electro-mechanical systems are extremely small sized (up to 1 micrometer) structures which perform one or more (mechanical, thermal, electronic or magnetic) functions on a particular chip. Metals, polymers, silicon and ceramics are some of the major types of material which are utilized in manufacturing of MEMS. It is highly difficult to create such structures due to their multi-physics characteristics.

The simulation software of SIMUSERV can be utilized for effective design and performance of MEMS. Effective piezoelectric analysis of MEMS can be performed using this simulation suite.

Multiple machines like copiers, scanners and printers need efficient and quick handling of the paper and related media for official or personal usage. The designers of these machines must ensure that quality images can be produced in minimum time through the machines for making them more popular among the users.

The designers can take support of simulation suite provided by SIMUSERV for successfully designing the paper flow process. Mis-feed conditions and impact of different paper types and various sheets can also be studied using simulation software from our company.

Sensitivity to moisture, shock vulnerability and thermal performance are some of the major factors that are taken into consideration while designing a semiconductor. Development of prototype combined with physical testing for semiconductor development is highly time taking procedure. So, using simulation environment for semiconductor design can enhance quality and save a lot of time.

The FEA integrated software suite from SIMUSERV helps in adding maximum perfection to the design of the semiconductors. There is also facility of material modeling of lead-free and leaded solder in the software. Non-FEA experts can also study workflows through process automation provided in the system which is expert generated.